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International Symposium on Biomedical Imaging and Sensing (BIS'14)

http://icacci-conference.org/website/BIS2014

The field of biomedical imaging and sensing assimilates several disciplines of electrical and computer engineering to solve problems of critical importance in clinical medicine. The International Symposium on Biomedical Imaging and Sensing (BIS'14) will bring together leading academics, scientists and researchers to exchange information and results of recent work on biomedical imaging and sensing. BIS'14 is affiliated with Third International Conference on Advances in Computing, Communications and Informatics (ICACCI-2014).

Prospective authors are invited to submit original technical papers for presentation at the conference and publication in the proceedings.  Submitted papers should report on original research work that falls within the scope of the workshop. Authors should submit their papers online via EDAS. Unregistered authors should first create an account on EDAS to log on. Further guidelines for submission are posted at: http://icacci-conference.org/website/call-papers

Topics of interest include, but are not limited to:

  • Acoustic and Stereo Imaging
  • Advanced Wireless Digital Systems
  • Applied Mathematics, Applied Physics, and Chemistry Related to Biomedical Imaging
  • Biomedical Devices for Remote Monitoring
  • Biomedical Image Processing, Pattern Recognition and Analysis
  • Biomedical Image Visualization, Compression, Transmission, and Storage
  • Biomedical Imaging Instrumentation
  • Compressed Sensing
  • Computational and Statistical Image Processing and Analysis
  • Diffusion-Weighted Imaging
  • Emerging Biomedical Imaging Techniques
  • Finite Element Analysis of Cardiac Responses
  • Functional, Cellular, and Molecular Imaging
  • Grid-Enabling Technology for Biomedical Imaging and Informatics
  • High Data Rate Wireless Protocols & Processing for Bio-Signals
  • Hybrid Imaging
  • Image Formation, Processing and Analysis, Performance Assessment
  • Imaging Assays for Screening and Molecular Analysis
  • Imaging Modality Fusion
  • Magnetic Resonance Imaging
  • Microarray Image Analysis and Bioinformatics
  • Microwave Imaging For Biomedical Applications
  • Microwave Systems for Imaging, Diagnostics & Therapeutics
  • Molecular Imaging
  • Neutron Imaging for Biomedical Applications
  • Personal Area Networks and Body Area Networks
  • Sensors in Biomedical and Environmental Applications
  • Small Animal Imaging
  • Ultrasound Imaging
  • Visualization
  • Wireless Positioning Technologies in Medicine
  • Wireless Technologies for Micro Medical Sensors

 

All submissions will be thoroughly peer-reviewed by experts in the field based on originality, significance and clarity, only papers presenting novel research results or successful innovative applications are considered for publication in the conference proceedings. The accepted and presented papers will be published in the conference proceedings and submitted to IEEE Xplore as well as other Abstracting and Indexing (A&I) databases. Independently of the presentation type, all papers are included in the proceedings.

 

Technical Program Committee

Program Chair(s)

Lei Xu, Qualcomm Inc., USA
Sunil Kumar Kopparapu, Tata Consultancy Services, India
 

TPC Members

Abdellah Chehri, University of Ottawa, Canada
Abhishek Choudhary, IBM, India
Ahmed Alattab, FSKTM - University of Malaya, Malaysia
Ahmed Amein, Military Technical College, Cairo, Egypt
Ajay Singh, National Institute of Technology Raipur, Chhattisgarh, India
Alaa Abdel-Hakim, Assiut University, Egypt
Ali Al-Faris, Universiti Sains Malaysia, Malaysia
Ali Awad, Lulea University of Technology, Sweden
Amin Al-Habaibeh, United kingdom, United Kingdom
Ananda Mohan, University of Technology Sydney (UTS), Australia
Andrea Ricci, University of Parma, Italy
Ankit Chaudhary, MUM, USA
Ashraf Hossain, National Institute of Technology Silchar, India
Ayesha Choudhary, IIT Delhi, India
Azian Azamimi Abdullah, Universiti Malaysia Perlis, Malaysia
Bestoun Ahmed, Universiti Sains Malaysia, Malaysia
Bo Zhou, Qualcomm Inc., USA
Boriphat Methachan, National Metal and Materials Technology Center, Thailand
Buddha Singh, JNU new Delhi, India
Chiranjib Sur, ABV-Indian Institute of Information Technology, Gwalior, India
Chockalingam Vaithilingam, Taylor's University, Malaysia
Christopher Tucker, University of Reading, United Kingdom
Christos Stentoumis, National Technical University of Athens, Greece
Cong Bai, Zhejiang University of Technology, P.R. China
Daniel Cesarini, University of Pisa, Italy
David Troncoso Romero, Institute INAOE, Mexico
Davide Ariu, University of Cagliari, Italy
Dimitrios Karras, Sterea Hellas Institute of Technology, Athens, Greece
Dimitrios Stratogiannis, National Technical University of Athens, Greece
Djamel Abed, Université 8 mai 1945 Guelma, Algeria
Djamel Bouchaffra, CDTA, Algeria
Duaa alSaeed, Northumbria University, Saudi Arabia
Elyas Rakhshani, Abengoa Research, Spain
Erik Markert, Chemnitz University of Technology, Germany
Fateh Krim, University of setif, Algeria
Felix J. Garcia Clemente, University of Murcia, Spain
Fethi Farhani, University of Tunis, Tunisia
Francesca Paradiso, University of Florence, Italy
Gholamreza Akbarizadeh, Shahid Chamran University, Iran
Gökay Akıncı, Ankara University, Turkey
Hao Wang, The Chinese University of Hong Kong, Hong Kong
Haytham Elmiligi, University of Victoria, Canada
Hemanta Pati, IIIT Bhubaneswar, India
Hetul Sanghvi, Texas Instruments Inc, India
Hing Keung Lau, The Open University of Hong Kong, Hong Kong
Hossein Malekmohamadi, University of Surrey, United Kingdom
Hossein Shokri-Ghadikolaei, Sharif University of Technology, Iran
Houbing Song, West Virginia University, USA
Hui Liu, University of Rostock, Germany
Ibrahim Mansour, Al-Ahliyya Amman University, Jordan
I-Shyan Hwang, Yuan-Ze University, Taiwan
Ivan Cabezas, Universidad de San Buenaventura, Colombia
Jassim Abdul-Jabbar, University of Mosul, Iraq
Javad Jafarian, University of Manchester, United Kingdom
Jitendra Lulla, Chelsio Communications, India
José Mario De Martino, University of Campinas - UNICAMP, Brazil
Joy Chen, Dayeh University, Taiwan
Jyoti Singh, National Institute of Technology Patna, India
Kapil Dev, Jaypee University of Information Technology, India
Kartick Subramanian, Nanyang Technological University, Singapore
Kedar Patwardhan, GE Global Research, USA
Kornél Bertók, University of Debrecen, Hungary
Kumaravel Natesan, Anna University, India
Mahdi Mahmoodi Vaneghi, Shahed University, Iran
Manish Gupta, Hindustan Institute of Technology and Management, Agra, India
Manjula Udayanga Hemapala, University of Moratuwa, Sri Lanka
Maulika Patel, Dharmsinh Desai University, Nadiad, India
Mauro Tucci, University of Pisa, Italy
Michel Owayjan, American University of Science & Technology, Lebanon
Miguel Bordallo, University of Oulu, Finland
Mitsunori Makino, Chuo University, Japan
Mohamed Ben Halima, REGIM: REsearch Group on Intelligent Machines, Tunisia
Mohammad Haghighat, University of Miami, USA
Mohammad Pourhomayoun, UCLA, USA
Mohammed Aljebori, Nizwa College of Technology, Oman
Muhammad Fakhrul Yusuf, Universiti Utara Malaysia, Malaysia
Naghmeh Moradpoor, University of Abertay Dundee, United Kingdom
Narottam Chand, NIT Hamirpur, India
Narottam Das, Curtin University, Australia
Naveen Aggarwal, Panjab University, India
Navid Abedini, Qualcomm, USA
Ning Wang, CSR Technology Inc., USA
Omar Al-Kadi, University of Jordan, Jordan
Paolo Crippa, Università Politecnica delle Marche, Italy
Paramate Horkaew, Suranaree University of Technology, Thailand
Pradeep Singh, NIT, India
Quoc-Tuan Vien, Middlesex University, United Kingdom
Ram Saran, DRDO, Dehradun, India
Ramviyas Nattanmai Parasuraman, CERN, Switzerland
Ratnadip Adhikari, Jawaharlal Nehru University, New Delhi, India
Raveendra Rao, The University of Western Ontario, Canada
Ravinder Ahuja, Jaypee University of Information Technology, India
Remus Brad, ULB Sibiu, Romania
Rengarajan Amirtharajan, ECE Department / SEEE, India
Rizal Bahaweres, Institute Of Technology, Bandung (ITB), Indonesia
Robert Morelos-Zaragoza, San Jose State University, USA
Rozmie Razif Othman, Universiti Malaysia Perlis, Malaysia
Rui-fan Li, University of Post and Telecommunications, P.R. China
Rytis Rainys, Vilnius Gediminas Technical University, Lithuania
S. Ali Etemad, Carleton University, Canada
Sabri Abdelouahed, Faculty of Science Dhar el Mahraz Fes, Morocco
Sanjeev Gogga, Visvesvarayya Technological University, Belgaum, Karnataka, India
Santosh Kalwar, Lappeenranta University of Technology, Finland
Sarvesh Sharma, BITS-Pilani, India
Satya Ghrera, Jaypee University of Information Technology, India
Seyyed Amir Hadi Minoofam, University of Science and Culture (USC), Tehran, Iran
Shanmugasundaram Hariharan, TRP Engineering College (SRM Group), India
Shih-Hau Fang, Yuan Ze University, Taiwan
Shubham Joshi, Sri Aurobindo Institute of Technology, Indore, India
Shu-Ching Chen, Florida International University, USA
Sian Lun Lau, Sunway University, Malaysia
Sid Ahmed Berrabah, Royal Military Academy, Belgium
Sofiane Maza, University of Bordj Bouarreridj, Algeria
Sotiris Kotsiantis, University of Patras, Greece
Soumen Bag, International Institute of Information Technology, Bhubaneswar, India
Spyridon Mouroutsos, Democritus University of Thrace, Greece
Sucharita Mitra, University of Calcutta, India
Suman Sankar Bhunia, Jadavpur University, India
Sunil Jaiswal, HKUST, Hong Kong
Suresh Sundaram, Nanyang Technological University, Singapore
Suryakanth Gangashetty, IIIT Hyderabad, India
Tapas Sinha, North Eastern Hill University, India
Thanh Bui, University of Pierre and Marie Curie, France
Theofilos Chrysikos, University of Patras, Greece
Uday Kalyane, Visvesvarayya Technological University, Belgaum, Karnataka, India
Ukash Nakarmi, SUNY, University at Buffalo, USA
Vaibhav Gandhi, United Kingdom, United Kingdom
Vasanth Iyer, Florida International University, USA
Venakatasubramanian Adhinarayanan, Jayaram College of Engineering & tech, India
Vu Ha, INRS, University of Quebec, Canada
Walid Barhoumi, URSIIVA, Tunisia
Wanda Benesova, Slovak University of Technology in Bratislava, Slovakia
Xavier Baró, Universitat Oberta de Catalunya (UOC), Spain
Xia Li, Tennessee Technological University, USA
Xiangqian Chen, Florida International University, USA
Xin Huang, University of Oxford, United Kingdom
Yu Kuang, University of Nevada, Las Vegas, USA
Zheng Chang, University of Jyväskylä, Finland
Zhenxing Luo, USA, USA
Zhijie Shen, Hortonworks, Inc., USA

 

Key Dates

 

 Paper Submission Ends

June 13, 2014

 Acceptance Notification

July 20, 2014

 Final Paper Deadline

August 20, 2014

 Author Registration Closes

August 22, 2014

 Conference

24 – 27 September 2014

 

 

 

 

 

 

Contact Us

Email: icacci2014@gmail.com